Immersion Gold PCB 4 Layer Computer Circuit Board Assembly PCBA
Service
Specifications
- Layer: 4 Layer
- Material: FR-4
- Board Thickness: 1.6mm
- Surface Treatment: Immersion Gold
- Solder Mask: Blue
- Size: 79.32mm x 25.86mm
- Copper Thickness: 1.0oZ
- Min. Line Spacing: 0.25mm
- Min Trace Space: 0.25mm
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP
surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCBA capabilities:
Single- or double-sided mixed technology or SMT (Surface Mount) for
PCB assembly
Single- or double-sided BGA and micro-BGA installation and rework
with 100% X-ray inspection
PCB board components, including all types of BGAs, QFNs, CSPs,
0201, 01005, POP, and Pressfit Components in small quantities
Part Polarity Capacitors, SMT Polarized Capacitors, and
Through-Hole Polarized Capacitors
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation
Quality Assurance:
ISO9001 and ISO/TS16949 management systems
Lean production system
ERP and PTS system support for management
Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI
minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
