RoHS Lead Free Control Board BGA SMT PCB Assembly 2.4mm PCB Service

Specifications

1. Layer: 4 layer
2. Material: FR4
3. Board Thickness: 1.6mm
4. Surface Treatment: Lead free HASL
5. Solder Mask: Green
6. Size: 123mm*36mm
7. Copper Thickness: 1.5oZ
8. Min. Hole Size: 0.15mm
9. Min. Line Width: 0.08mm
10. Min. Line Spacing: 0.08mm
11. Hole vias: Buried hole and blind hole

• Technical requirement:
  • Professional surface-mounting and through-hole soldering technology
  • Various sizes are available, like 1206, 0805, 0603 components SMT technology
  • ICT (in circuit test), FCT (functional circuit test) technology
  • PCB assembly with UL, CE, FCC and RoHS approvals
  • Nitrogen gas reflow soldering technology for SMT
  • High standard SMT and solder assembly line
  • High density interconnected board placement technology capacity

• Quote requirement:
  • Gerber file of the bare PCB board
  • BOM (bill of material) for assembly
  • To short the lead time, please kindly advise us if there is any acceptable components substitution
  • Testing guide and test fixtures if necessary
  • Programming files and programming tool if necessary
  • Schematic if necessary

• OEM/ODM/EMS services for PCBA:
  • PCBA, PCB assembly: SMT, PTH and BGA
  • PCBA and enclosure design
  • Components sourcing and purchasing
  • Quick prototyping
  • Plastic injection molding
  • Metal sheet stamping
  • Final assembly
  • Test: AOI, in-circuit test (ICT), functional test (FCT)
  • Custom clearance for material importing and product exporting

• Orientronic PCB assembly equipmet

• Fully automatic SMT stencil printer: FolunGwin Win-5
  • SMT machine: Siemens SIPLACE D1/D2/Siemens SIPLACE S20/F4
  • Reflow oven: FolunGwin FL-RX860
  • Wave soldering machine: FolunGwin ADS300
  • Automated optical inspection (AOI): Aleader ALD-H-350B
• Needed:
  • PCB gerber file
  • BOM list for PCB assembly
  • Send us your sample PCB board or PCBA
• Advantages:
  • Turnkey manufacturing or quick-turn prototypes
  • Board-level assembly or complete system integration
  • Low-volume or mixed-technology assembly for PCBA
  • Even consignment production
  • Supported capabilities
• Type of assembly:
  • THD (thru-hole device)/conventional
  • SMT (surface-mount technology)
  • SMT and THD mixed
  • Double-sided SMT and/or THD assembly
• Components:
  • Passives, smallest size 0201
  • Fine pitch to 08 Mils
  • Leadless chip carriers/BGA, VFBGA, FPGA and DFN
  • Connectors and terminals
• Component packaging:
  • Reels
  • Cut tape
  • Tube
  • Loose parts
• Board dimensions:
  • Smallest size: 0.25 x 0.25 inch/6 x 6mm
  • Largest size: 15.75 x 13.5 inches/400 x 340mm
• Board shape:
  • Rectangular
  • Round
  • Slots
  • Cutouts
  • Complex
  • Irregular
• Board type:
  • Rigid
  • Flexible
  • Rigid-flexible
• Solder type:
  • Leaded and lead-free
  • Water soluble solder paste
  • Manual soldering for special parts, such as wires and temperature sensitive parts
• Design file format:
  • Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG
  • BOM (bill of materials)
  • Pick and place file (XYRS)