OEM PCB PCBA Assembly Service, SMT DIP Production Line, Shenzhen
Printed Circuits Board Assembly
Specifications
1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly ( which including plastics, metal box,
Coil, cable inside etc)
6. Packing design
7. Quantities range from prototype to medium batch production.
8.100% E-Test
PCB capability and services:
1. Single-sided, double-sided & multi layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP
surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil,
cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available.
Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the
electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion
caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of
all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI
minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
flash Device Programming
Functional testing
Application
Products are applied to a wide range of High-tech industries such
as: LED, telecommunication, computer application, lighting, game
machine, industrial control, power, automobile and high-end
consumer electronics, ect. By unremitting work and effort to the
marketing, products exports to American, Canada, Europe counties,
Africa and other Asia-pacific countries
