Printed Circuit PCB Boards With 6 Layers Design Diagram Immersion
Gold Finished Assembly Electronics Products
PCB Assembly includes the manufacturing process of Surface Mount
Technology(SMT), Manual Insertion (MI), Auto-insertion (AI) and
Chip on Board(COB).
※ Surface Mount Technology
※ Pin Through-hole Assembly
※ RoHS
※ Selective Wave Soldering
※ Conformal Coating
※ Complete box build
※ Inspection Methods
Surface Mount Technology
Employing state of the art DEK printers, Placement machines and BTU
convection air reflow ovens. With many years experience of placing
BGA, UBGA, CSP and small profile passives down to and including
0201, the plant offers a cost effective high yield solution to any
SMT requirement.
Pin Through Hole
Capabilities to place tape and reeled radial components sizes.
Maximum PCB size is 25" x 25". Placement rates reach 5000 pieces
per hour with an accuracy of 99% minimizing component loss.
RoHS Regulations
Full lead based processing for exempt category product, whilst also
having invested in lead-free equipment and process control.
Selective Wave Solder
Having the Selective Wave soldering machines, with consistent
quality and process control when assembling boards having multiple
ground and power planes, high-current connectors or A-typical
distribution of components.
Conformal coating
Both dip-coating and vertical spray coating is available.
Protecting non conductive dielectric layer that is applied onto the
printed circuit board assembly to protect the electronic assembly
from damage due to contamination, salt spray, moisture, fungus,
dust and corrosion caused by harsh or extreme environments. When
coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of
all components, electromechanical parts, plastics, casings and
print & packaging material
Applications:
Products are applied to a wide range of High-tech industries such
as: telecommunication, computer
application, industrial control, power, automobile and high-end
consumer electronics, etc. We offer our
customers a wide range material and boards.
Huaswin Electronics is a professional Printed Circuit Boards manufacturer with many
years’ experience in China.
Detailed Specification of PCB Manufacturing
1 | layer | 1-30 layer |
2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
3 | Board thickness | 0.2mm-6mm |
4 | Max.finished board size | 800*508mm |
5 | Min.drilled hole size | 0.25mm |
6 | min.line width | 0.075mm(3mil) |
7 | min.line spacing | 0.075mm(3mil) |
8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing, Plastic bag |
12 | Outer packing | standard carton packing |
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
15 | Profiling punching | Routing,V-CUT,Beveling |
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP
surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
